Calculators | American Embedded

PCB calculator

// VIA CURRENT BREAKPOINT

I = J * pi(d*t + t^2)

Compare increasing plated via diameter against adding more vias. The sweep varies finished hole diameter and via count while enforcing hole-edge spacing and maximum footprint size.

Inputs

Needed current A Max footprint width mm Max footprint height mm Min finished hole mm Max swept hole mm Plating thickness um Annular ring mm Hole edge spacing mm Allowable temp rise C Reference temp rise C Reference density A/m^2

Min via rating 0.00 A

Min via count 0

Array footprint 0 x 0 mm

Single equivalent 0.00 mm

Best swept array -

Swept footprint -

Area Versus Current

single, minimum, and mixed arrays

One enlarged via Min via array Best mixed array Target current

Current Versus Footprint

best capacity inside each rectangular budget

Largest single via Packed min vias Best mixed array Footprint budget

2D Hole / Count Sweep

finished hole diameter against via count

Meets current and footprint Meets current, over footprint Under current Best swept point

Target Layout

hole-edge spacing enforced

Model Readout

Effective density: 0 A/m^2
Min via copper area: 0 mm^2
Center pitch: 0 mm
Footprint limit: 0 x 0 mm
Array capacity: 0 A
Single-via area: 0 mm^2
Array area: 0 mm^2
Best sweep: -
Best sweep capacity: 0 A

Set the operating point.

Rule-of-thumb model only. It estimates via current from copper cross-section using 10^7 A/m^2 as the default steady-state current density and does not replace thermal, fabrication, or reliability review.